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Mounting

Support for everything from prototyping and small-lot production to mass production.
A comprehensive testing system including visual inspection, electric current testing, and more.

Mounting workflow
Support for BGA, LGA, and fine-pitch mounting
TOMCOM provides surface mounting to circuit boards with BGA or LGA sockets, and to circuit boards that present very difficult mounting challenges, such as 0603 chip sizes and fine-pitch components. Mounting is available for circuit board sizes ranging from 50 x 50 mm to 510 x 460 mm.
State-of-the-art lead-free production facilities
he TOMCOM production line provides a high level of lead-free production, for minimal environmental impact. Out production system can support orders ranging from prototyping to mass production in the tens of thousands. The system is flexible enough to handle 1,200 changes per month.
A reliable total product inspection system lets no defects get through
In addition to imaging, 3D visual imaging, and X-ray imaging, and other inspection processes, the TOMCOM inspection system also includes electric current testing. Of course, inspection of all components is also available.
BGA and CSP repair
TOMCOM also can provide BGA and CSP reball and repair. We also support hand-inserted circuit boards.
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